transistors thyristors

IMBF170R1K0M1

Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.

00 — Overview

What the IMBF170R1K0M1 family does

The IMBF170R1K0M1 is a CoolSiC™ 1700V SiC Trench MOSFET optimized for fly-back topologies. It features a 1700V drain-source voltage, 5.2A DC drain current, 1000mΩ on-resistance, and a 175°C virtual junction temperature. The device operates with a 4.5V gate threshold and supports 12V/0V gate-source compatibility. Engineers typically use this component in solar string inverters, central inverters, industrial UPS systems, SMPS, and chargers. Its low switching losses enable higher frequency operation while reducing system complexity and cooling requirements. The part qualifies for industrial applications per JEDEC standards.

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Start building with IMBF170R1K0M1 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.
01 — Key specifications

IMBF170R1K0M1 datasheet parameters

ParameterMinTypMaxConditionsSource
rds on 1 Ohm Infineon datasheet, p. 1 — Table 1 Key Performance and Package Parameters
operating temperature (abs max) -55 °C 175 °C Infineon datasheet, p. 3 — Table 2 Maximum ratings
power dissipation (abs max) 68 W Infineon datasheet, p. 3 — Table 2 Maximum ratings
breakdown voltage ds (abs max) 1.7 kV Infineon datasheet, p. 3 — Table 2 Maximum ratings
drain current 100 nA VGS = 20V, VDS = 0V; zero{gss}; Static characteristics (at $ Tvj = 25^{\circ}C $, unless otherwise specified) Infineon datasheet, p. 5 — Table 4 Static characteristics (at , unless otherwise specified)
vgs threshold 3.5 V 4.5 V 5.7 V (tested after 1 ms pulse atVGS = 20V)I_D = 1.1mA, VDS = VGSTvj = 25^\circ C; gate(th); Static characteristics (at $ Tvj = 25^{\circ}C $, unless otherwise specified) Infineon datasheet, p. 5 — Table 4 Static characteristics (at , unless otherwise specified)
input capacitance 275 pF VDD = 1000V, VGS = 0V, f = 1MHz, VAC = 25mV; {iss}; Dynamic characteristics (at $ Tvj = 25^{\circ}C $, unless otherwise specified) Infineon datasheet, p. 6 — Table 5 Dynamic characteristics (at , unless otherwise specified)
output capacitance 7.2 pF VDD = 1000V, VGS = 0V, f = 1MHz, VAC = 25mV; {oss}; Dynamic characteristics (at $ Tvj = 25^{\circ}C $, unless otherwise specified) Infineon datasheet, p. 6 — Table 5 Dynamic characteristics (at , unless otherwise specified)
reverse transfer capacitance 700 fF Infineon datasheet, p. 6 — Table 5 Dynamic characteristics (at , unless otherwise specified)
gate charge 5 nC VDD = 1000V, I_D = 1A, VGS = 0/12V, \text{turn-on pulse}; Dynamic characteristics (at $ Tvj = 25^{\circ}C $, unless otherwise specified) Infineon datasheet, p. 6 — Table 5 Dynamic characteristics (at , unless otherwise specified)
rise time 14 ns VDD = 1000V, I_D = 1A, VGS = 0/12V, RG, ext = 22\Omega, L_\sigma = 40nH, diode:body diode atVGS = 0Vsee Fig. E; 3.3 Switching characteristics Infineon datasheet, p. 7 — 3.3 Switching characteristics
fall time 22 ns VDD = 1000V, I_D = 1A, VGS = 0/12V, RG, ext = 22\Omega, L_\sigma = 40nH, diode:body diode atVGS = 0Vsee Fig. E; 3.3 Switching characteristics Infineon datasheet, p. 7 — 3.3 Switching characteristics
03 — Alternatives

Closest matches to IMBF170R1K0M1

IPD60R360P7S 5.6× lower rds on, 2.8× higher output capacitance, 2.6× lower breakdown voltage ds
HL2300 11.4× higher output capacitance, 7.5× lower vgs threshold, 1.5× higher input capacitance
HT80N15ARDZ 3.8× lower rds on, 2.8× higher output capacitance, 2.2× higher gate charge
IMZ120R045M1 18.6× higher reverse transfer capacitance, 16.0× higher output capacitance, 10.4× higher gate charge
MDD2301 6.9× higher output capacitance, 1.4× higher fall time, 1.3× higher gate charge
AOD409 10.8× higher input capacitance, 8.8× higher gate charge, 1.5× lower fall time
AOD4185 9.3× higher input capacitance, 8.4× higher gate charge, 1.4× higher rise time
BUK7230-55A 4.9× higher rise time, 4.8× higher gate charge, 3.1× higher input capacitance
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