transistors thyristors

HT80N10ARDZ

Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.

00 — Overview

What the HT80N10ARDZ family does

The HT80N10ARDZ is an 800 V N-Channel SiC MOSFET available in a DFN-8(5x6) package with a Pb-free suffix. It operates across a junction temperature range of -55 to 175 °C and features a drain-source breakdown voltage of 650 V. The device exhibits a static drain-source on-resistance of 360 mΩ at 25 °C and a total gate charge of 10.6 nC. It supports a continuous drain current of 12 A at 25 °C and 9 A at 100 °C. This component is typically used in power factor correction modules, switch mode power supplies, power inverters, and high voltage converters. Its low capacitances enable high-speed switching, while its thermal characteristics reduce heat sink requirements and increase power density.

Next step
Start building with HT80N10ARDZ → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.
01 — Key specifications

HT80N10ARDZ datasheet parameters

ParameterMinTypMaxConditionsSource
rds on 360 mOhm 400 mOhm VGS = 15 V, ID = 6 A, TJ = 25°C; rds(on); Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
forward voltage 4 V VGS = -4V, ISD = 5A, TJ = 25°C; vsd; Reverse SiC Diode Characteristics HTCsemi datasheet, p. 2 — Reverse SiC Diode Characteristics
operating temperature -55 °C 175 °C HTCsemi datasheet, p. 1 — Applications
power dissipation 5.22 kW Tc = 25°CTc = 100°C; ptot; Applications HTCsemi datasheet, p. 1 — Applications
forward current 12 A TC = 25°C; Reverse SiC Diode Characteristics HTCsemi datasheet, p. 2 — Reverse SiC Diode Characteristics
reverse leakage current 2 µA 100 µA VGS = 0 V, VDS = 750 V; idss; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
breakdown voltage ds 650 V 850 V VGS = 0 V, ID = 1 mA; v(br); Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
drain current 129 A Tc = 25°CTc = 100°C; id; Applications HTCsemi datasheet, p. 1 — Applications
vgs threshold 3.5 V 4.2 V VGS = VDS, IDS = 1 mA, TJ = 25°C; vgs(th); Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
input capacitance 208 pF VDS = 400 V, f = 1 MHz, VGS = 0 V; ciss; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
output capacitance 18 pF VDS = 400 V, f = 1 MHz, VGS = 0 V; coss; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
reverse transfer capacitance 1.8 pF VDS = 400 V, f = 1 MHz, VGS = 0 V; crss; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
gate charge 10.6 nC VDD = 400 V, VGS = -5/18 V, ID = 5 A; qg; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
rise time 17 ns VDD = 400 V, ID = 5 A, RG = 10 Ω, VGS = -5/18 V; tr; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
fall time 10 ns VDD = 400 V, ID = 5 A, RG = 10 Ω, VGS = -5/18 V; tf; Electrical Characteristics HTCsemi datasheet, p. 2 — Electrical Characteristics
reverse recovery time 50 ns ISD = 5 A, di/dt = 1000 A/μs, VDD = 400 V, VGS = -5 V; trr; Reverse SiC Diode Characteristics HTCsemi datasheet, p. 2 — Reverse SiC Diode Characteristics
02 — FAQ

HT80N10ARDZ frequently asked questions

What is the breakdown voltage (ds) under the condition of VGS = 0 V, ID = 1 mA?

The breakdown voltage is 850 V.

What is the drain current of the HT80N10ARDZ at Tc = 25°C and Tc = 100°C?

The drain current is 129 A.

What is the fall time (tf) of the HT80N10ARDZ under the conditions VDD = 400 V, ID = 5 A, RG = 10 Ω, and VGS = -5/18 V?

The fall time (tf) is 10 ns.

What is the forward current of the HT80N10ARDZ under Reverse SiC Diode Characteristics at TC = 25°C?

The forward current is 12 A.

What is the forward voltage of the reverse SiC diode?

The forward voltage is 4 V at VGS = -4V, ISD = 5A, and TJ = 25°C.

What is the gate charge (qg) under the conditions VDD = 400 V, VGS = -5/18 V, and ID = 5 A?

The gate charge is 10.6 nC.

What is the input capacitance (Ciss) of the HT80N10ARDZ?

The input capacitance is 208 pF at VDS = 400 V, f = 1 MHz, and VGS = 0 V.

What is the maximum operating temperature for the HT80N10ARDZ?

The maximum operating temperature is 175 °C.

What is the output capacitance (coss) of the HT80N10ARDZ under the conditions VDS = 400 V, f = 1 MHz, and VGS = 0 V?

The output capacitance is 18 pF.

What is the power dissipation of the HT80N10ARDZ at Tc = 25°CTc = 100°C; ptot; Applications?

The power dissipation is 5.22 kW.

What is the maximum on-state resistance (rds(on)) for the HT80N10ARDZ?

The rds(on) is 360 mOhm at VGS = 15 V, ID = 6 A, and TJ = 25°C.

What is the reverse leakage current (idss) when VGS = 0 V and VDS = 750 V?

The reverse leakage current is 2 µA.

03 — Alternatives

Closest matches to HT80N10ARDZ

HT80N15ARDZ 11.7× higher drain current, 2.0× lower reverse leakage current, 2.0× lower reverse transfer capacitance
IPD60R360P7S 8.6× lower drain current, 2.0× lower rds on, 2.0× lower reverse leakage current
HL2310A 12.9× lower drain current, 12.5× lower breakdown voltage ds, 10.8× higher reverse transfer capacitance
2N7002 12.5× lower breakdown voltage ds, 7.8× higher rds on, 6.7× lower input capacitance
FDV303N 5.0× higher reverse transfer capacitance, 4.4× lower vgs threshold, 4.2× lower input capacitance
Si2301CDS 4.2× higher output capacitance, 4.0× lower rds on, 2.1× higher rise time
HL2302 16.1× lower drain current, 13.9× higher reverse transfer capacitance, 8.0× lower rds on
IMZ120R045M1 9.1× higher input capacitance, 8.0× lower rds on, 7.2× higher reverse transfer capacitance
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