embedded processors controllers

STM32F103

Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.

00 — Overview

What the STM32F103 family does

The STM32F103x8 and STM32F103xB are medium-density 32-bit microcontrollers featuring an Arm Cortex-M3 core running at 72 MHz. These devices offer 64 or 128 KB of Flash memory, 20 KB of SRAM, and support 2x 12-bit ADCs, two I2C interfaces, up to three USARTs, a CAN interface, and a USB 2.0 full-speed port. Available in packages ranging from 48 to 100 pins, they operate on a 2.0 to 3.6 V supply. The family includes variants like the STM32F103C8, STM32F103R8, and STM32F103V8, providing up to 80 fast I/O ports. Engineers typically use these MCUs for applications requiring high performance, low power consumption, and extensive communication capabilities in embedded systems.

Next step

Start building with STM32F103 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.

Ordering code: STM32F103C8STM32F103CBSTM32F103R8STM32F103RBSTM32F103T8

01 — Key specifications

STM32F103C8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	650 nA	1.2 µA	idd(lsi); LSI oscillator characteristics $ ^{(1)} $	ST datasheet, p. 55 — Table 25. LSI oscillator characteristics
output current (abs max)	—	—	-25 mA	i{io}; Current characteristics	ST datasheet, p. 38 — Table 7. Current characteristics
supply voltage range	1.8 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
clock frequency	0 Hz	—	72 MHz	fhclk; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
power dissipation	—	—	454 mW	LFBGA100; pd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
input capacitance	—	5 pF	—	cin(lse); Low-speed external user clock characteristics	ST datasheet, p. 51 — Table 21. Low-speed external user clock characteristics
cpu speed	—	72 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
ram size	—	20 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
io count	—	37	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	4 ns	—	20 ns	CL = 50 pF; tr; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention

02 — FAQ

STM32F103C8 frequently asked questions

What is the ADC resolution of the STM32F103C8?

The ADC resolution is 12 bit.

What is the maximum clock frequency (fhclk) under general operating conditions?

The maximum clock frequency (fhclk) under general operating conditions is 72 MHz.

What is the core size of the STM32F103C8?

The core size is 32 bit.

What is the maximum CPU speed of the STM32F103C8?

The maximum CPU speed is 72 MHz.

What is the data retention period for the STM32F103C8 Flash memory after 1 kcycle at TA = 85 °C?

The data retention is 30 year.

What is the fall time (tf) when CL = 50 pF?

The fall time is 20 ns.

What is the input capacitance for the Low-speed external user clock characteristics?

The input capacitance is 5 pF.

How many I/O pins does the STM32F103C8 have?

The STM32F103C8 has 37 I/O pins.

What is the maximum operating temperature under general operating conditions?

The maximum operating temperature is 85 °C.

What is the output current (i_io) for the STM32F103C8?

The output current (i_io) is -25 mA.

What is the power dissipation for the STM32F103C8 in LFBGA100 package under general operating conditions?

The power dissipation is 454 mW.

What is the program erase cycles for the STM32F103C8 under the conditions TA = -40 to +85 °C (6 suffix versions) and TA = -40 to +105 °C (7 suffix versions)?

The program erase cycles are 10 kcycle.

01 — Key specifications

STM32F103CB datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	36 mA	—	72 MHz; All peripherals enabled(2); idd; Typical current consumption in Run mode, code with data processing running from Flash	ST datasheet, p. 47 — Table 17. Typical current consumption in Run mode, code with data process…
output current (abs max)	—	—	-25 mA	i{io}; Current characteristics	ST datasheet, p. 38 — Table 7. Current characteristics
supply voltage range	2 V	—	3.6 V	vdd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
clock frequency	600 kHz	—	14 MHz	fadc; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics
power dissipation	—	—	434 mW	LQFP100; pd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
input capacitance	—	5 pF	—	cin(hse); High-speed external user clock characteristics	ST datasheet, p. 50 — Table 20. High-speed external user clock characteristics
cpu speed	—	72 MHz	—		ST datasheet, p. 1
program memory size	—	128 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
ram size	—	20 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
io count	—	37	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	4 ns	—	20 ns	CL = 50 pF; tr; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
sample rate	50 kHz	—	1 MHz	fs; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics

02 — FAQ

STM32F103CB frequently asked questions

What is the ADC resolution of the STM32F103CB?

The ADC resolution is 12 bit.

What is the clock frequency for ADC characteristics?

The clock frequency is 14 MHz.

What is the core size of the STM32F103CB?

The core size is 32 bit.

What is the maximum CPU speed of the STM32F103CB?

The maximum CPU speed is 72 MHz.

What is the data retention period for the STM32F103CB Flash memory endurance and data retention specification?

The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.

What is the fall time (tf) when the load capacitance (CL) is 50 pF?

The fall time is 20 ns.

What is the input capacitance for the High-speed external user clock (cin(hse))?

The input capacitance for the High-speed external user clock (cin(hse)) is 5 pF.

What is the number of I/O ports available on the STM32F103CB?

The STM32F103CB has 37 I/O ports.

What is the maximum operating temperature under general operating conditions with maximum power dissipation?

The maximum operating temperature is 85 °C.

What is the output current (i{io}) for the STM32F103CB?

The output current (i{io}) is -25 mA.

What is the power dissipation for the STM32F103CB in LQFP100 package under general operating conditions?

The power dissipation is 434 mW.

What is the program erase cycle endurance for the STM32F103CB Flash memory?

The program erase cycle endurance is 10 kcycle at TA = -40 to +85 °C (6 suffix versions) and TA = -40 to +105 °C (7 suffix versions).

01 — Key specifications

STM32F103R8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	80 µA	100 µA	idd(hsi); HSI oscillator characteristics $ ^{(1)} $	ST datasheet, p. 54 — Table 24. HSI oscillator characteristics
output current (abs max)	—	—	-25 mA	i{io}; Current characteristics	ST datasheet, p. 38 — Table 7. Current characteristics
supply voltage range	1.8 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
clock frequency	600 kHz	—	14 MHz	fadc; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics
power dissipation	—	—	454 mW	LFBGA100; pd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
input capacitance	—	5 pF	—	cin(hse); High-speed external user clock characteristics	ST datasheet, p. 50 — Table 20. High-speed external user clock characteristics
cpu speed	—	72 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
ram size	—	20 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
io count	—	51	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	4 ns	—	20 ns	CL = 50 pF; tr; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
load capacitance	—	30 pF	—	RS = 30 Ω; c(rs); HSE 4-16 MHz oscillator characteristics $ ^{(1)} $ (2)	ST datasheet, p. 52 — Table 22. HSE 4-16 MHz oscillator characteristics (2)
sample rate	50 kHz	—	1 MHz	fs; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics

01 — Key specifications

STM32F103RB datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	80 µA	100 µA	idd(hsi); HSI oscillator characteristics $ ^{(1)} $	ST datasheet, p. 54 — Table 24. HSI oscillator characteristics
output current (abs max)	—	—	-25 mA	i{io}; Current characteristics	ST datasheet, p. 38 — Table 7. Current characteristics
supply voltage range	1.8 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
clock frequency	600 kHz	—	14 MHz	fadc; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics
power dissipation	—	—	454 mW	LFBGA100; pd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
input capacitance	—	5 pF	—	cin(hse); High-speed external user clock characteristics	ST datasheet, p. 50 — Table 20. High-speed external user clock characteristics
cpu speed	—	72 MHz	—		ST datasheet, p. 1
program memory size	—	128 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
ram size	—	20 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
io count	—	51	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	4 ns	—	20 ns	CL = 50 pF; tr; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
load capacitance	—	30 pF	—	RS = 30 Ω; c(rs); HSE 4-16 MHz oscillator characteristics $ ^{(1)} $ (2)	ST datasheet, p. 52 — Table 22. HSE 4-16 MHz oscillator characteristics (2)
sample rate	50 kHz	—	1 MHz	fs; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics

01 — Key specifications

STM32F103T8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	80 µA	100 µA	idd(hsi); HSI oscillator characteristics $ ^{(1)} $	ST datasheet, p. 54 — Table 24. HSI oscillator characteristics
output current (abs max)	—	—	-25 mA	i{io}; Current characteristics	ST datasheet, p. 38 — Table 7. Current characteristics
supply voltage range	1.8 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
clock frequency	600 kHz	—	14 MHz	fadc; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics
power dissipation	—	—	454 mW	LFBGA100; pd; General operating conditions	ST datasheet, p. 38 — Table 9. General operating conditions
input capacitance	—	5 pF	—	cin(hse); High-speed external user clock characteristics	ST datasheet, p. 50 — Table 20. High-speed external user clock characteristics
cpu speed	—	72 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
ram size	—	20 KB	—		ST datasheet, p. 10 — Table 2. STM32F103xx medium-density device features and peripheral counts
io count	—	26	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	4 ns	—	20 ns	CL = 50 pF; tr; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; Driver characteristics	ST datasheet, p. 73 — Table 46. USB: Full-speed electrical characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 57 — Table 29. Flash memory endurance and data retention
load capacitance	—	30 pF	—	RS = 30 Ω; c(rs); HSE 4-16 MHz oscillator characteristics $ ^{(1)} $ (2)	ST datasheet, p. 52 — Table 22. HSE 4-16 MHz oscillator characteristics (2)
sample rate	50 kHz	—	1 MHz	fs; ADC characteristics	ST datasheet, p. 74 — Table 47. ADC characteristics

03 — Alternatives

Closest matches to STM32F103

STM32F411CC 6.2× higher ram size, 3.9× higher program memory size, 1.4× higher cpu speed

STM32F411CCU6 6.2× higher ram size, 3.9× higher program memory size, 1.4× higher cpu speed

GD32F103RFT6 10.0× higher program erase cycles, 5.8× lower clock frequency, 4.8× higher ram size

STM32F072C8 10.4× higher fall time, 10.4× higher rise time, 1.5× lower clock frequency

STM32F405OE 16.0× higher program memory size, 9.8× higher ram size, 2.3× higher cpu speed

STM32F405OET6 16.0× higher program memory size, 9.8× higher ram size, 2.3× higher cpu speed

ST7590 11.7× lower clock frequency, 10.0× higher program erase cycles, 3.0× lower data retention

GD32F303CCT5 11.7× lower clock frequency, 10.0× higher program erase cycles, 3.9× higher program memory size

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