STM32F411CC
Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.
What the STM32F411CC family does
The STM32F411xC and STM32F411xE are 32-bit ARM Cortex-M4 microcontrollers featuring a floating-point unit, 125 DMIPS performance, and up to 512 KB of Flash memory. These devices offer 128 KB of SRAM, an 11-bit ADC, and support for USB OTG FS alongside up to 13 communication interfaces including I2C, USART, and SPI. Available in WLCSP, UFQFPN, LQFP, and UFBGA packages, the family operates from 1.7 V to 3.6 V. Key specifications include a maximum clock frequency of 100 MHz, power consumption as low as 100 µA/MHz during active operation, and deep power-down modes drawing down to 10 µA. Engineers typically utilize these microcontrollers for applications requiring high processing speed, complex signal processing via the FPU, and extensive connectivity options in industrial or consumer electronics.
STM32F411CC datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 60 µA | 80 µA | idd(hsi); HSI oscillator characteristics $ (1) $ | ST datasheet, p. 85 — Table 39. HSI oscillator characteristics |
| output current (abs max) | — | — | -25 mA | i{io}; Current characteristics | ST datasheet, p. 61 — Table 12. Current characteristics |
| supply voltage range | 3 V | — | 3.6 V | USB OTG FS DC electrical characteristics | ST datasheet, p. 109 — Table 63. USB OTG FS DC electrical characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 63 — Table 14. General operating conditions (continued) |
| clock frequency | 600 kHz | 15 MHz | 18 MHz | VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics | ST datasheet, p. 110 — Table 65. ADC characteristics |
| power dissipation | — | — | 625 mW | UFQFPN48; pd; General operating conditions | ST datasheet, p. 62 — Table 14. General operating conditions |
| input capacitance | — | 5 pF | — | cin(hse); High-speed external user clock characteristics | ST datasheet, p. 81 — Table 35. High-speed external user clock characteristics |
| cpu speed | — | 100 MHz | — | ST datasheet, p. 16 | |
| program memory size | — | 250 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| ram size | — | 125 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| io count | — | 36 | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 11 | |
| core size | — | 32 bit | — | ST datasheet, p. 16 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| contact current | — | 50 µA | — | VDD = 3.3 VC = CINT; 2 MHz; iddio; Switching output I/O current consumption | ST datasheet, p. 77 — Table 32. Switching output I/O current consumption |
| data retention | 30 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
| program erase cycles | 10 kcycle | — | — | TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
STM32F411CC frequently asked questions
What is the ADC resolution for the STM32F411CC?
The ADC resolution is 12 bit.
What is the clock frequency when VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics?
The clock frequency is 15 MHz.
What is the contact current for the STM32F411CC when VDD = 3.3 V, C = CINT, and the frequency is 2 MHz?
The contact current is 50 µA.
What is the core size of the STM32F411CC?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F411CC?
The maximum CPU speed is 100 MHz.
What is the data retention period for the STM32F411CC Flash memory endurance and data retention specification?
The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.
What is the fall time (tf) for the USB OTG FS electrical characteristics when CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance for the High-speed external user clock characteristics?
The input capacitance is 5 pF.
What is the I/O count for the STM32F411CC?
The I/O count is 36.
What is the maximum operating temperature under general operating conditions?
The maximum operating temperature is 85 °C.
What is the output current (I_OH) for the STM32F411CC?
The output current is -25 mA.
What is the power dissipation for the STM32F411CC in a UFQFPN48 package under general operating conditions?
The power dissipation is 625 mW.
STM32F411CE datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 60 µA | 80 µA | idd(hsi); HSI oscillator characteristics $ (1) $ | ST datasheet, p. 85 — Table 39. HSI oscillator characteristics |
| output current (abs max) | — | — | -25 mA | i{io}; Current characteristics | ST datasheet, p. 61 — Table 12. Current characteristics |
| supply voltage range | 3 V | — | 3.6 V | USB OTG FS DC electrical characteristics | ST datasheet, p. 109 — Table 63. USB OTG FS DC electrical characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 63 — Table 14. General operating conditions (continued) |
| clock frequency | 600 kHz | 15 MHz | 18 MHz | VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics | ST datasheet, p. 110 — Table 65. ADC characteristics |
| power dissipation | — | — | 625 mW | UFQFPN48; pd; General operating conditions | ST datasheet, p. 62 — Table 14. General operating conditions |
| input capacitance | — | 5 pF | — | cin(hse); High-speed external user clock characteristics | ST datasheet, p. 81 — Table 35. High-speed external user clock characteristics |
| cpu speed | — | 100 MHz | — | ST datasheet, p. 16 | |
| program memory size | — | 500 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| ram size | — | 125 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| io count | — | 36 | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 11 | |
| core size | — | 32 bit | — | ST datasheet, p. 16 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| contact current | — | 50 µA | — | VDD = 3.3 VC = CINT; 2 MHz; iddio; Switching output I/O current consumption | ST datasheet, p. 77 — Table 32. Switching output I/O current consumption |
| data retention | 30 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
| program erase cycles | 10 kcycle | — | — | TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
STM32F411CE frequently asked questions
What is the ADC resolution of the STM32F411CE?
The ADC resolution is 12 bit.
What is the maximum clock frequency for the ADC when VDDA is between 1.7 V and 2.4 V?
The maximum clock frequency is 15 MHz.
What is the contact current for the STM32F411CE when VDD = 3.3 V, C = CINT, and the frequency is 2 MHz?
The contact current is 50 µA.
What is the core size of the STM32F411CE?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F411CE?
The maximum CPU speed is 100 MHz.
What is the data retention period for the STM32F411CE Flash memory after 1 kcycle at TA = 85 °C?
The data retention is 30 year.
What is the fall time (tf) of the STM32F411CE under USB OTG FS electrical characteristics when CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance for the High-speed external user clock characteristics (cin(hse))?
The input capacitance for cin(hse) is 5 pF.
What is the I/O count for the STM32F411CE?
The I/O count is 36.
What is the maximum operating temperature under general operating conditions for maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current (I_OH) for the STM32F411CE?
The output current (I_OH) is -25 mA.
What is the power dissipation for the STM32F411CE in a UFQFPN48 package under general operating conditions?
The power dissipation is 625 mW.
STM32F411RC datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 60 µA | 80 µA | idd(hsi); HSI oscillator characteristics $ (1) $ | ST datasheet, p. 85 — Table 39. HSI oscillator characteristics |
| output current (abs max) | — | — | -25 mA | i{io}; Current characteristics | ST datasheet, p. 61 — Table 12. Current characteristics |
| supply voltage range | 3 V | — | 3.6 V | USB OTG FS DC electrical characteristics | ST datasheet, p. 109 — Table 63. USB OTG FS DC electrical characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 63 — Table 14. General operating conditions (continued) |
| clock frequency | 600 kHz | 15 MHz | 18 MHz | VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics | ST datasheet, p. 110 — Table 65. ADC characteristics |
| power dissipation | — | — | 625 mW | UFQFPN48; pd; General operating conditions | ST datasheet, p. 62 — Table 14. General operating conditions |
| input capacitance | — | 5 pF | — | cin(hse); High-speed external user clock characteristics | ST datasheet, p. 81 — Table 35. High-speed external user clock characteristics |
| cpu speed | — | 100 MHz | — | ST datasheet, p. 16 | |
| program memory size | — | 250 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| ram size | — | 125 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| io count | — | 50 | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 11 | |
| core size | — | 32 bit | — | ST datasheet, p. 16 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| contact current | — | 50 µA | — | VDD = 3.3 VC = CINT; 2 MHz; iddio; Switching output I/O current consumption | ST datasheet, p. 77 — Table 32. Switching output I/O current consumption |
| data retention | 30 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
| program erase cycles | 10 kcycle | — | — | TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
STM32F411RC frequently asked questions
What is the ADC resolution for the STM32F411RC?
The ADC resolution is 12 bit.
What is the clock frequency when VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics?
The clock frequency is 15 MHz.
What is the contact current for the STM32F411RC when VDD = 3.3 V, C = CINT, and the frequency is 2 MHz?
The contact current is 50 µA.
What is the core size of the STM32F411RC?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F411RC?
The maximum CPU speed is 100 MHz.
What is the data retention period for the STM32F411RC Flash memory endurance and data retention specification?
The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.
What is the fall time (tf) for the USB OTG FS electrical characteristics when CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance for the High-speed external user clock characteristics (cin(hse))?
The input capacitance for the High-speed external user clock characteristics (cin(hse)) is 5 pF.
What is the I/O count for the STM32F411RC?
The I/O count is 50.
What is the operating temperature under maximum power dissipation at ta with general operating conditions?
The operating temperature is 85 °C.
What is the output current (I_O) specified in the Current characteristics for the STM32F411RC?
The output current (I_O) is -25 mA.
What is the power dissipation for the STM32F411RC in a UFQFPN48 package under general operating conditions?
The power dissipation is 625 mW.
STM32F411RE datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 60 µA | 80 µA | idd(hsi); HSI oscillator characteristics $ (1) $ | ST datasheet, p. 85 — Table 39. HSI oscillator characteristics |
| output current (abs max) | — | — | -25 mA | i{io}; Current characteristics | ST datasheet, p. 61 — Table 12. Current characteristics |
| supply voltage range | 3 V | — | 3.6 V | USB OTG FS DC electrical characteristics | ST datasheet, p. 109 — Table 63. USB OTG FS DC electrical characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 63 — Table 14. General operating conditions (continued) |
| clock frequency | 600 kHz | 15 MHz | 18 MHz | VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics | ST datasheet, p. 110 — Table 65. ADC characteristics |
| power dissipation | — | — | 625 mW | UFQFPN48; pd; General operating conditions | ST datasheet, p. 62 — Table 14. General operating conditions |
| input capacitance | — | 5 pF | — | cin(hse); High-speed external user clock characteristics | ST datasheet, p. 81 — Table 35. High-speed external user clock characteristics |
| cpu speed | — | 100 MHz | — | ST datasheet, p. 16 | |
| program memory size | — | 500 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| ram size | — | 125 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| io count | — | 50 | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 11 | |
| core size | — | 32 bit | — | ST datasheet, p. 16 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| contact current | — | 50 µA | — | VDD = 3.3 VC = CINT; 2 MHz; iddio; Switching output I/O current consumption | ST datasheet, p. 77 — Table 32. Switching output I/O current consumption |
| data retention | 30 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
| program erase cycles | 10 kcycle | — | — | TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
STM32F411RE frequently asked questions
What is the ADC resolution for the STM32F411RE?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32F411RE when VDDA = 1.7(1)to 2.4 V and fadc; ADC characteristics?
The clock frequency is 15 MHz.
What is the contact current for the STM32F411RE when VDD = 3.3 V, C = CINT, and the frequency is 2 MHz?
The contact current is 50 µA.
What is the core size of the STM32F411RE?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F411RE?
The maximum CPU speed is 100 MHz.
What is the data retention period for the STM32F411RE Flash memory endurance and data retention specification?
The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.
What is the fall time (tf) for the USB OTG FS electrical characteristics when CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance for the High-speed external user clock characteristics?
The input capacitance is 5 pF.
What is the I/O count for the STM32F411RE?
The I/O count is 50.
What is the maximum operating temperature under general operating conditions?
The maximum operating temperature is 85 °C.
What is the output current (i{io}) for the STM32F411RE?
The output current (i{io}) is -25 mA.
What is the power dissipation for the STM32F411RE in a UFQFPN48 package under general operating conditions?
The power dissipation is 625 mW.
STM32F411VC datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 60 µA | 80 µA | idd(hsi); HSI oscillator characteristics $ (1) $ | ST datasheet, p. 85 — Table 39. HSI oscillator characteristics |
| output current (abs max) | — | — | -25 mA | i{io}; Current characteristics | ST datasheet, p. 61 — Table 12. Current characteristics |
| supply voltage range | 3 V | — | 3.6 V | USB OTG FS DC electrical characteristics | ST datasheet, p. 109 — Table 63. USB OTG FS DC electrical characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 63 — Table 14. General operating conditions (continued) |
| clock frequency | 600 kHz | 15 MHz | 18 MHz | VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics | ST datasheet, p. 110 — Table 65. ADC characteristics |
| power dissipation | — | — | 625 mW | UFQFPN48; pd; General operating conditions | ST datasheet, p. 62 — Table 14. General operating conditions |
| input capacitance | — | 5 pF | — | cin(hse); High-speed external user clock characteristics | ST datasheet, p. 81 — Table 35. High-speed external user clock characteristics |
| cpu speed | — | 100 MHz | — | ST datasheet, p. 16 | |
| program memory size | — | 250 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| ram size | — | 125 KB | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| io count | — | 81 | — | ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 11 | |
| core size | — | 32 bit | — | ST datasheet, p. 16 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $ | ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics |
| contact current | — | 50 µA | — | VDD = 3.3 VC = CINT; 2 MHz; iddio; Switching output I/O current consumption | ST datasheet, p. 77 — Table 32. Switching output I/O current consumption |
| data retention | 30 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
| program erase cycles | 10 kcycle | — | — | TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention | ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention |
STM32F411VC frequently asked questions
What is the ADC resolution for the STM32F411VC?
The ADC resolution is 12 bit.
What is the maximum clock frequency for the ADC when VDDA is between 1.7 V and 2.4 V?
The maximum clock frequency is 15 MHz.
What is the contact current for the STM32F411VC?
The contact current is 50 µA when VDD = 3.3 V, C = CINT, and the frequency is 2 MHz under switching output I/O current consumption conditions.
What is the core size of the STM32F411VC?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F411VC?
The maximum CPU speed is 100 MHz.
What is the data retention period for the STM32F411VC Flash memory endurance and data retention specification?
The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.
What is the fall time (tf) under the condition of CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance for the High-speed external user clock characteristics?
The input capacitance is 5 pF.
What is the I/O count for the STM32F411VC?
The I/O count is 81.
What is the maximum operating temperature under general operating conditions?
The maximum operating temperature is 85 °C.
What is the output current (i{io}) for the STM32F411VC?
The output current (i{io}) is -25 mA.
What is the power dissipation for the STM32F411VC in a UFQFPN48 package under general operating conditions?
The power dissipation is 625 mW.