Build with GD32F303 — Datasheet Specs & AI Design Help

00 — Overview

What the GD32F303 does

The GD32F303xx family comprises 32-bit microcontrollers based on the ARM Cortex-M4 core. These devices span multiple package sizes, including LQFP144, LQFP100, LQFP64, and LQFP48, catering to diverse design requirements. The MCU features 512 KB of Flash memory and 64 KB of SRAM. It operates with a voltage range of 2.0 V to 3.6 V and supports a maximum clock frequency of 120 MHz. The architecture includes 16 general-purpose timers, two hardware cryptographic accelerators, and multiple communication interfaces such as CAN, SPI, and I2C. Engineers typically utilize this part for embedded control systems, industrial automation, and consumer electronics requiring high performance and low power consumption.

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Start building with GD32F303 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.

01 — Key specifications

Datasheet parameters

Datasheet parameters for GD32F303
Parameter	Min	Typ	Max	Conditions	Source
supply voltage range	2.6 V	3.3 V	3.6 V	—; vdd; DC operating conditions	GigaDevice datasheet, p. 51 — Table 4-2. DC operating conditions
operating temperature	-20 °C	—	85 °C		GigaDevice datasheet, p. 89 — Table 6-2. Part ordering code for GD32F303xx devices (Cont.)
input capacitance	—	5 pF	—	—; cin; Low speed external user clock characteristics (LXTAL in bypass mode)	GigaDevice datasheet, p. 64 — Table 4-16. Low speed external user clock characteristics (LXTAL…
cpu speed	—	120 MHz	—		GigaDevice datasheet, p. 8
program memory size	—	250 KB	—	flash	GigaDevice datasheet, p. 89 — Table 6-2. Part ordering code for GD32F303xx devices (Cont.)
ram size	—	46.9 KB	—		GigaDevice datasheet, p. 9 — Table 2-1. GD32F303xx devices features and peripheral list
io count	—	37	—		GigaDevice datasheet, p. 39 — Table 2-7. GD32F303Cx LQFP48 pin definitions
adc resolution	—	12 bit	—		GigaDevice datasheet, p. 8
core size	—	32 bit	—		GigaDevice datasheet, p. 8
rise time	4 ns	—	20 ns	CL = 50 pF; tr; USBD full speed-electrical characteristics $ ^{(1)} $	GigaDevice datasheet, p. 76 — Table 4-39. USBD full speed-electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; USBD full speed-electrical characteristics $ ^{(1)} $	GigaDevice datasheet, p. 76 — Table 4-39. USBD full speed-electrical characteristics
data retention	—	20 year	—	—; tret; Flash memory characteristics	GigaDevice datasheet, p. 67 — Table 4-21. Flash memory characteristics
program erase cycles	100 kcycle	—	—	TA = -40 °C ~ +85 °C; pecyc(endurance); Flash memory characteristics	GigaDevice datasheet, p. 67 — Table 4-21. Flash memory characteristics
sample rate	7 kHz	—	2.86 MHz	12-bit; fs; GD32F303xx Datasheet	GigaDevice datasheet, p. 70 — GD32F303xx Datasheet
settling time	—	300 ns	1 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsetting; GD32F303xx Datasheet	GigaDevice datasheet, p. 72 — GD32F303xx Datasheet

02 — Alternatives

Closest matches to GD32F303

ST7590 2.0× lower data retention, 2.0× lower program memory size, 1.5× lower ram size

GD32F303CCT6 2.5× lower load capacitance, 1.4× lower operating temperature, similar ram size

GD32F103RFT6 2.8× lower sample rate, 2.0× higher ram size, 2.0× higher clock frequency

STM32F103C8 11.7× higher clock frequency, 10.0× lower program erase cycles, 3.9× lower program memory size

STM32F411CC 10.4× higher clock frequency, 10.0× lower program erase cycles, 2.7× higher ram size

STM32F411CCU6 10.4× higher clock frequency, 10.0× lower program erase cycles, 2.7× higher ram size

GD32F405RET6 4.1× higher ram size, 2.5× lower load capacitance, 2.0× higher program memory size

AT32F415KBU7 2.0× lower program memory size, 1.5× lower ram size, 1.2× higher cpu speed

03 — FAQ

Frequently asked questions

What is the ADC resolution of the GD32F303CCT5?

The ADC resolution is 12 bit.

What is the core size of the GD32F303CCT5?

The core size is 32 bit.

What is the CPU speed of the GD32F303CCT5?

The CPU speed is 120 MHz.

What is the data retention time for the GD32F303CCT5 Flash memory characteristics at tret?

The data retention is 20 year.

What is the fall time (tf) for USBD full speed-electrical characteristics when CL = 50 pF?

The fall time is 20 ns.

What is the input capacitance for the low speed external user clock characteristics (LXTAL in bypass mode)?

The input capacitance is 5 pF.

What is the number of I/O ports?

The GD32F303CCT5 has 37 I/O ports.

What is the maximum operating temperature for the GD32F303CCT5?

The maximum operating temperature is 85 °C.

What is the program erase cycle endurance for the GD32F303CCT5 Flash memory at TA = -40 °C ~ +85 °C?

The program erase cycle endurance is 100 kcycle.

What is the program memory size of the GD32F303CCT5?

The program memory size is 250 KB in flash.

What is the RAM size of the GD32F303CCT5?

The RAM size is 46.9 KB.

What is the rise time (tr) for USBD full speed-electrical characteristics when CL = 50 pF?

The rise time is 20 ns.