GD32F103
Full part number: GD32F103RFT6
Every spec below is cited to the manufacturer datasheet. Compare the closest alternatives, then ask the assistant what it means for your design.
What the GD32F103 does
The GD32F103xx is a 32-bit microcontroller based on the Arm Cortex-M3 core. This family spans multiple package sizes including LQFP144, LQFP100, LQFP64, LQFP48, and QFN36, covering various pin counts for diverse application needs. The device features 512 KB flash memory, 64 KB SRAM, and operates from a 2.5 V to 3.6 V supply. It integrates 16 timers, two CAN controllers, and multiple communication interfaces including SPI, I2C, and USART. Engineers typically use this MCU for embedded control systems, industrial automation, and consumer electronics requiring high performance and low power consumption in a single chip solution.
Datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 45.6 mA | — | VDD = VDDA = 3.3 V, HXTAL = 8 MHz, System clock = 108 MHz, All peripheralsenabled; idd(run mode); Power consumption characteristics (for GD32F103x4/6/8/B devices) $ ^{(2)(3)(4)(5)(6)} $ | GigaDevice datasheet, p. 61 — Table 4-9. Power consumption characteristics (for GD32F103x4/6/8/… |
| supply voltage range | 2.6 V | 3.3 V | 3.6 V | —; vdd; DC operating conditions | GigaDevice datasheet, p. 59 — Table 4-2. DC operating conditions |
| operating temperature (abs max) | -40 °C | — | 85 °C | ta; Absolute maximum ratings $ (1)(4) $ | GigaDevice datasheet, p. 59 — Table 4-1. Absolute maximum ratings |
| clock frequency | 0 Hz | — | 54 MHz | fTIMERxCLK = 108 MHz; fext; TIMER characteristics $ ^{(1)} $ | GigaDevice datasheet, p. 94 — Table 4-55. TIMER characteristics |
| power dissipation (abs max) | — | — | 697 mW | pd; Absolute maximum ratings $ (1)(4) $ | GigaDevice datasheet, p. 59 — Table 4-1. Absolute maximum ratings |
| input capacitance | — | 5 pF | — | —; cin; Low speed external user clock characteristics (LXTAL in bypass mode) | GigaDevice datasheet, p. 74 — Table 4-21. Low speed external user clock characteristics (LXTAL… |
| psrr | 55 dB | 80 dB | — | —; psrr(to vdda); GD32F103xx Datasheet | GigaDevice datasheet, p. 85 — GD32F103xx Datasheet |
| cpu speed | — | 108 MHz | — | GigaDevice datasheet, p. 8 | |
| ram size | — | 96 KB | — | GigaDevice datasheet, p. 10 — Table 2-2. GD32F103xx devices features and peripheral list (conti… | |
| io count | — | 51 | — | GigaDevice datasheet, p. 40 — Table 2-7. GD32F103Rx LQFP64 pin definitions | |
| adc resolution | — | 12 bit | — | GigaDevice datasheet, p. 8 | |
| core size | — | 32 bit | — | GigaDevice datasheet, p. 8 | |
| rise time | 4 ns | — | 20 ns | CL = 50 pF; tr; USBD full speed-electrical characteristics (For GD32F103x4/6/8/B devices) (1) | GigaDevice datasheet, p. 91 — Table 4-49. USBD full speed-electrical characteristics (For GD32F… |
| fall time | 4 ns | — | 20 ns | CL = 50 pF; tf; USBD full speed-electrical characteristics (For GD32F103x4/6/8/B devices) (1) | GigaDevice datasheet, p. 91 — Table 4-49. USBD full speed-electrical characteristics (For GD32F… |
| data retention | — | 20 year | — | —; tret; Flash memory characteristics (For GD32F103x4/6/8/B devices) | GigaDevice datasheet, p. 77 — Table 4-27. Flash memory characteristics (For GD32F103x4/6/8/B de… |
| program erase cycles | 100 kcycle | — | — | TA = -40 °C ~ +85 °C; pecyc(endurance); Flash memory characteristics (For GD32F103x4/6/8/B devices) | GigaDevice datasheet, p. 77 — Table 4-27. Flash memory characteristics (For GD32F103x4/6/8/B de… |
| output voltage high | — | 2.18 V | — | VDD = 3.3 V; voh; IO_Speed = 10MHz | GigaDevice datasheet, p. 79 — GD32F103xx Datasheet |
| output voltage low | — | 290 mV | — | VDD = 2.6V; vol; IO_Speed = 10MHz | GigaDevice datasheet, p. 79 — GD32F103xx Datasheet |
| sample rate | 40 kHz | — | 1 MHz | 12-bit; fs; ADC characteristics(For GD32F103xC/D/E/F/G/I/K devices) | GigaDevice datasheet, p. 83 — Table 4-35. ADC characteristics(For GD32F103xC/D/E/F/G/I/K device… |
| settling time | — | 300 ns | 1 µs | CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsetting; GD32F103xx Datasheet | GigaDevice datasheet, p. 85 — GD32F103xx Datasheet |
Closest matches to GD32F103
Frequently asked questions
What is the ADC resolution of the GD32F103RFT6?
The ADC resolution is 12 bit.
What is the clock frequency for the GD32F103RFT6 when fTIMERxCLK = 108 MHz and fext; TIMER characteristics $ ^{(1)} $?
The clock frequency is 54 MHz.
What is the core size of the GD32F103RFT6?
The core size is 32 bit.
What is the maximum CPU speed of the GD32F103RFT6?
The maximum CPU speed is 108 MHz.
What is the data retention time for the GD32F103RFT6 Flash memory?
The data retention is 20 year at —; tret; Flash memory characteristics (For GD32F103x4/6/8/B devices).
What is the fall time (tf) for USBD full speed-electrical characteristics when CL = 50 pF?
The fall time is 20 ns.
What is the input capacitance (cin) for the Low speed external user clock characteristics (LXTAL in bypass mode)?
The input capacitance is 5 pF.
How many I/O pins does the GD32F103RFT6 have?
The GD32F103RFT6 has 51 I/O pins.
What is the operating temperature (ta) under Absolute maximum ratings (1)(4) for the GD32F103RFT6?
The operating temperature (ta) under Absolute maximum ratings (1)(4) is 85 °C.
What is the output voltage high (VOH) when VDD = 3.3 V and IO_Speed = 10MHz?
The output voltage high is 2.18 V.
What is the output voltage low specification for the GD32F103RFT6?
The output voltage low is 290 mV when VDD = 2.6V; vol; IO_Speed = 10MHz.
What is the power dissipation (pd) under Absolute maximum ratings (1)(4)?
The power dissipation is 697 mW.