Build with STM32F411 — Datasheet Specs & AI Design Help

00 — Overview

What the STM32F411 does

The STM32F411xC and STM32F411xE are 32-bit ARM Cortex-M4 microcontrollers featuring a floating-point unit, 125 DMIPS performance, and up to 512 KB of Flash memory. These devices offer 128 KB of SRAM, an 11-bit ADC, and support for USB OTG FS alongside up to 13 communication interfaces including I2C, USART, and SPI. Available in WLCSP, UFQFPN, LQFP, and UFBGA packages, the family operates from 1.7 V to 3.6 V. Key specifications include a maximum clock frequency of 100 MHz, power consumption as low as 100 µA/MHz during active operation, and deep power-down modes drawing down to 10 µA. Engineers typically utilize these microcontrollers for applications requiring high processing speed, complex signal processing via the FPU, and extensive connectivity options in industrial or consumer electronics.

Next step

Start building with STM32F411 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.

01 — Key specifications

Datasheet parameters

Datasheet parameters for STM32F411
Parameter	Min	Typ	Max	Conditions	Source
output current (abs max)	—	—	25 mA	i{io}; Current characteristics	ST datasheet, p. 61 — Table 12. Current characteristics
supply voltage range	1.65 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 62 — Table 14. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 63 — Table 14. General operating conditions (continued)
clock frequency	600 kHz	15 MHz	18 MHz	VDDA = 1.7(1)to 2.4 V; fadc; ADC characteristics	ST datasheet, p. 110 — Table 65. ADC characteristics
power dissipation	—	—	625 mW	UFQFPN48; pd; General operating conditions	ST datasheet, p. 62 — Table 14. General operating conditions
input capacitance	—	5 pF	—	cin(lse); Low-speed external user clock characteristics	ST datasheet, p. 82 — Table 36. Low-speed external user clock characteristics
cpu speed	—	100 MHz	—		ST datasheet, p. 16
program memory size	—	250 KB	—		ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts
ram size	—	125 KB	—		ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts
io count	—	36	—		ST datasheet, p. 12 — Table 2. STM32F411xC/xE features and peripheral counts
adc resolution	—	12 bit	—		ST datasheet, p. 11
core size	—	32 bit	—		ST datasheet, p. 16
rise time	4 ns	—	20 ns	CL = 50 pF; tr; USB OTG FS electrical characteristics $ ^{(1)} $	ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics
fall time	4 ns	—	20 ns	CL = 50 pF; tf; USB OTG FS electrical characteristics $ ^{(1)} $	ST datasheet, p. 110 — Table 64. USB OTG FS electrical characteristics
contact current	—	450 µA	—	VDD = 3.3 VC = CINT; 25 MHz; iddio; Switching output I/O current consumption	ST datasheet, p. 77 — Table 32. Switching output I/O current consumption
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +85 °C (6 suffix versions)TA = -40 to +105 °C (7 suffix versions); Flash memory endurance and data retention	ST datasheet, p. 92 — Table 47. Flash memory endurance and data retention

02 — Alternatives

Closest matches to STM32F411

STM32F411CC similar adc resolution, similar clock frequency, similar contact current

STM32F103C8 6.2× lower ram size, 3.9× lower program memory size, 1.4× lower cpu speed

STM32F405OE 4.1× higher program memory size, 2.5× lower contact current, 2.2× higher clock frequency

STM32F405OET6 4.1× higher program memory size, 2.5× lower contact current, 2.2× higher clock frequency

GD32F103RFT6 10.0× higher program erase cycles, 5.1× lower clock frequency, 1.5× higher quiescent current

GD32F303CCT5 10.4× lower clock frequency, 10.0× higher program erase cycles, 2.7× lower ram size

GD32F303CCT6 10.4× lower clock frequency, 10.0× higher program erase cycles, 2.6× lower ram size

ST7590 10.4× lower clock frequency, 10.0× higher program erase cycles, 4.0× lower ram size

03 — FAQ

Frequently asked questions

What is the ADC resolution of the STM32F411CCU6?

The ADC resolution is 12 bit.

What is the clock frequency for ADC characteristics when VDDA is between 1.7 V and 2.4 V?

The clock frequency is 15 MHz.

What is the contact current for the STM32F411CCU6 when VDD = 3.3 V, C = CINT, and the switching output I/O frequency is 25 MHz?

The contact current is 450 µA.

What is the core size of the STM32F411CCU6?

The core size is 32 bit.

What is the maximum CPU speed of the STM32F411CCU6?

The maximum CPU speed is 100 MHz.

What is the data retention period for the STM32F411CCU6 Flash memory endurance and data retention specification?

The data retention is 30 year at 1 kcycle(2)at TA = 85 °C; tret.

What is the fall time (tf) when CL = 50 pF?

The fall time is 20 ns.

What is the input capacitance for the Low-speed external user clock (cin(lse))?

The input capacitance is 5 pF.

What is the I/O count for the STM32F411CCU6?

The I/O count is 36.

What is the maximum operating temperature under general operating conditions for maximum power dissipation?

The maximum operating temperature is 85 °C.

What is the output current (i{io}) under Current characteristics?

The output current (i{io}) under Current characteristics is 25 mA.

What is the power dissipation for the STM32F411CCU6 in a UFQFPN48 package under general operating conditions?

The power dissipation is 625 mW.