embedded processors controllers

STM32F072

Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.

00 — Overview

What the STM32F072 family does

The STM32F072x8 is an Arm-based 32-bit microcontroller featuring up to 128 KB of Flash memory and 16 KB of SRAM. It operates on a digital supply of 2.0 V to 3.6 V and supports a clock frequency up to 48 MHz. This family includes variants like the STM32F072C8, STM32F072R8, and STM32F072V8, available in FBGA, LQFP, and WLCSP packages. The device integrates a crystal-less USB 2.0 full-speed interface, a CAN controller, and 12 timers for precise timing tasks. It also provides a 12-bit ADC with 16 channels and a 12-bit DAC. Engineers typically use this MCU for applications requiring low power consumption, such as battery-operated devices, alongside touch sensing capabilities for capacitive buttons and linear sensors. The part supports multiple low-power modes including Sleep, Stop, and Standby to extend battery life in portable electronics.

Next step

Start building with STM32F072 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.

Ordering code: STM32F072C8STM32F072CBSTM32F072R8STM32F072RBSTM32F072V8

01 — Key specifications

STM32F072C8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	500 nA	900 nA	low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz)	ST datasheet, p. 69 — Table 40. LSE oscillator characteristics ( kHz)
output current (abs max)	—	—	-25 mA	iio(pin); Current characteristics	ST datasheet, p. 52 — Table 22. Current characteristics
supply voltage range	2 V	—	3.6 V	vdd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
clock frequency	600 kHz	—	14 MHz	fadc; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
power dissipation	—	—	364 mW	UFBGA100; pd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
cpu speed	—	48 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
ram size	—	16 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	—	—	5 ns	CL = 30 pF, VDDIOx≥ 2.7 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
fall time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +105 °C; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
sample rate	43 kHz	—	1 MHz	12-bit resolution; fs; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
settling time	—	3 µs	4 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsettling; DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)

02 — FAQ

STM32F072C8 frequently asked questions

What is the ADC resolution of the STM32F072C8?

The ADC resolution is 12 bit.

What is the maximum clock frequency for the ADC characteristics?

The maximum clock frequency for the ADC characteristics is 14 MHz.

What is the core size of the STM32F072C8?

The core size is 32 bit.

What is the maximum CPU speed of the STM32F072C8?

The maximum CPU speed is 48 MHz.

What is the data retention period for the STM32F072C8 Flash memory after 1 kcycle at TA = 85 °C?

The data retention is 30 year.

What is the fall time when CL = 50 pF and VDDIOx≥ 2 V; (i/o)?

The fall time is 25 ns.

What is the maximum operating temperature under general operating conditions?

The maximum operating temperature is 85 °C.

What is the output current specification for the STM32F072C8 under iio(pin) conditions?

The output current is -25 mA.

What is the power dissipation for the STM32F072C8 in UFBGA100 package under general operating conditions?

The power dissipation is 364 mW.

What is the program erase cycle endurance for the STM32F072C8 Flash memory at TA = -40 to +105 °C?

The program erase cycle endurance is 10 kcycle.

What is the program memory size of the STM32F072C8?

The program memory size is 64 KB.

What is the quiescent current (idd) for the STM32F072C8 with low drive capability and LSE oscillator characteristics at fLSE = 32.768 kHz?

The quiescent current (idd) is 500 nA.

01 — Key specifications

STM32F072CB datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	500 nA	900 nA	low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz)	ST datasheet, p. 69 — Table 40. LSE oscillator characteristics ( kHz)
output current (abs max)	—	—	-25 mA	iio(pin); Current characteristics	ST datasheet, p. 52 — Table 22. Current characteristics
supply voltage range	1.65 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
input offset voltage	—	5 mV	10 mV	vsc; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
clock frequency	—	24 MHz	—	fTIMxCLK = 48 MHz; fext; TIMx characteristics	ST datasheet, p. 92 — Table 64. TIMx characteristics
power dissipation	—	—	364 mW	UFBGA100; pd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
propagation delay	—	2 µs	4.5 µs	Ultra-low power mode; td; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
psrr	—	-67 dB	-40 dB	No RLOAD, CLOAD = 50 pF; psrr(static dc measurement); DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)
cpu speed	—	48 MHz	—		ST datasheet, p. 1
program memory size	—	128 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
ram size	—	16 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
io count	—	87	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
fall time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +105 °C; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
sample rate	43 kHz	—	1 MHz	12-bit resolution; fs; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
settling time	—	3 µs	4 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsettling; DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)

01 — Key specifications

STM32F072R8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	500 nA	900 nA	low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz)	ST datasheet, p. 69 — Table 40. LSE oscillator characteristics ( kHz)
output current (abs max)	—	—	-25 mA	iio(pin); Current characteristics	ST datasheet, p. 52 — Table 22. Current characteristics
supply voltage range	1.65 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
input offset voltage	—	5 mV	10 mV	vsc; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
clock frequency	—	24 MHz	—	fTIMxCLK = 48 MHz; fext; TIMx characteristics	ST datasheet, p. 92 — Table 64. TIMx characteristics
power dissipation	—	—	364 mW	UFBGA100; pd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
propagation delay	—	2 µs	4.5 µs	Ultra-low power mode; td; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
psrr	—	-67 dB	-40 dB	No RLOAD, CLOAD = 50 pF; psrr(static dc measurement); DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)
cpu speed	—	48 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
ram size	—	16 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
io count	—	87	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
fall time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +105 °C; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
sample rate	43 kHz	—	1 MHz	12-bit resolution; fs; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
settling time	—	3 µs	4 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsettling; DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)

01 — Key specifications

STM32F072RB datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	500 nA	900 nA	low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz)	ST datasheet, p. 69 — Table 40. LSE oscillator characteristics ( kHz)
output current (abs max)	—	—	-25 mA	iio(pin); Current characteristics	ST datasheet, p. 52 — Table 22. Current characteristics
supply voltage range	1.65 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
input offset voltage	—	5 mV	10 mV	vsc; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
clock frequency	—	24 MHz	—	fTIMxCLK = 48 MHz; fext; TIMx characteristics	ST datasheet, p. 92 — Table 64. TIMx characteristics
power dissipation	—	—	364 mW	UFBGA100; pd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
propagation delay	—	2 µs	4.5 µs	Ultra-low power mode; td; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
psrr	—	-67 dB	-40 dB	No RLOAD, CLOAD = 50 pF; psrr(static dc measurement); DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)
cpu speed	—	48 MHz	—		ST datasheet, p. 1
program memory size	—	128 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
ram size	—	16 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
io count	—	87	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
fall time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +105 °C; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
sample rate	43 kHz	—	1 MHz	12-bit resolution; fs; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
settling time	—	3 µs	4 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsettling; DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)

01 — Key specifications

STM32F072V8 datasheet parameters

Parameter	Min	Typ	Max	Conditions	Source
quiescent current	—	500 nA	900 nA	low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz)	ST datasheet, p. 69 — Table 40. LSE oscillator characteristics ( kHz)
output current (abs max)	—	—	-25 mA	iio(pin); Current characteristics	ST datasheet, p. 52 — Table 22. Current characteristics
supply voltage range	1.65 V	—	3.6 V	vbat; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
input offset voltage	—	5 mV	10 mV	vsc; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
operating temperature	-40 °C	—	85 °C	Maximum power dissipation; ta; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
clock frequency	—	24 MHz	—	fTIMxCLK = 48 MHz; fext; TIMx characteristics	ST datasheet, p. 92 — Table 64. TIMx characteristics
power dissipation	—	—	364 mW	UFBGA100; pd; General operating conditions	ST datasheet, p. 53 — Table 24. General operating conditions
propagation delay	—	2 µs	4.5 µs	Ultra-low power mode; td; Comparator characteristics	ST datasheet, p. 90 — Table 61. Comparator characteristics
psrr	—	-67 dB	-40 dB	No RLOAD, CLOAD = 50 pF; psrr(static dc measurement); DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)
cpu speed	—	48 MHz	—		ST datasheet, p. 1
program memory size	—	64 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
ram size	—	16 KB	—		ST datasheet, p. 11 — Table 2. STM32F072x8/xB family device features and peripheral counts
io count	—	87	—		ST datasheet, p. 1
adc resolution	—	12 bit	—		ST datasheet, p. 1
core size	—	32 bit	—		ST datasheet, p. 1
rise time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
fall time	—	—	25 ns	CL = 50 pF, VDDIOx≥ 2 V; (i/o)	ST datasheet, p. 82 — Table 55. I/O AC characteristics
data retention	30 year	—	—	1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
program erase cycles	10 kcycle	—	—	TA = -40 to +105 °C; Flash memory endurance and data retention	ST datasheet, p. 75 — Table 47. Flash memory endurance and data retention
sample rate	43 kHz	—	1 MHz	12-bit resolution; fs; ADC characteristics	ST datasheet, p. 84 — Table 57. ADC characteristics
settling time	—	3 µs	4 µs	CLOAD≤ 50 pF, RLOAD≥ 5 kΩ; tsettling; DAC characteristics	ST datasheet, p. 89 — Table 60. DAC characteristics (continued)

03 — Alternatives

Closest matches to STM32F072

STM32G071C8 9.6× higher quiescent current, 6.2× lower output current, 4.8× higher sample rate

STM32F030C8 10.0× lower program erase cycles, 2.0× lower ram size, 1.8× lower quiescent current

STM32F030K6T6 10.0× lower program erase cycles, 4.1× lower ram size, 2.0× lower program memory size

STM32F103C8 10.4× lower fall time, 10.4× lower rise time, 1.5× higher clock frequency

STM32L011D3 8.2× lower program memory size, 8.2× lower ram size, 6.3× lower rise time

MSPM0G3507 6.2× lower output current, 2.7× lower quiescent current, 2.4× lower clock frequency

STM32F405OE 16.0× higher program memory size, 12.2× higher ram size, 10.4× lower fall time

STM32F405OET6 16.0× higher program memory size, 12.2× higher ram size, 10.4× lower fall time

Design help What do I need around the STM32F072? →