embedded processors controllers

GD32E230

Full part number: GD32E230C8T6

Every spec below is cited to the manufacturer datasheet. Compare the closest alternatives, then ask the assistant what it means for your design.

00 — Overview

What the GD32E230 does

The GD32E230xx is a 32-bit microcontroller based on the ARM Cortex-M23 core. This family spans multiple variants including the GD32E230Cx, Kx, Gx, and Fx series, available in LQFP48, LQFP32, QFN32, QFN28, TSSOP20, and LGA20 packages. It features 64 KB to 512 KB of flash memory, up to 64 KB of SRAM, and operates from a 1.8 V to 3.6 V supply. The device includes a high-speed 48 MHz internal oscillator, a 12-bit ADC, multiple timers, and communication interfaces such as USART, SPI, and I2C. Engineers typically use this MCU for cost-sensitive applications requiring low power consumption and high integration, such as consumer electronics, industrial control, and smart home devices.

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Start building with GD32E230 → Every number above is cited straight from the datasheet — ask what they mean for your design, and the assistant answers from the same source documents.
01 — Key specifications

Datasheet parameters

Datasheet parameters for GD32E230
ParameterMinTypMaxConditionsSource
quiescent current 8.1 µA Medium power mode; idd; GD32E230xx Datasheet GigaDevice datasheet, p. 60 — GD32E230xx Datasheet
supply voltage range 1.8 V 3.3 V 3.6 V —; vdd; DC operating conditions GigaDevice datasheet, p. 43 — Table 4-2. DC operating conditions
operating temperature (abs max) -40 °C 85 °C ta; Absolute maximum ratings GigaDevice datasheet, p. 43 — Table 4-1. Absolute maximum ratings
clock frequency 0 Hz 72 MHz —; fapb1; Clock frequency GigaDevice datasheet, p. 44 — Table 4-3. Clock frequency
input capacitance 5 pF —; cin; Low speed external user clock characteristics (LXTAL in bypass mode) GigaDevice datasheet, p. 52 — Table 4-17. Low speed external user clock characteristics (LXTAL…
cpu speed 72 MHz GigaDevice datasheet, p. 8
program memory size 62.5 KB flash GigaDevice datasheet, p. 71 — Table 6-1. Part ordering code for GD32E230xx devices
ram size 8 KB GigaDevice datasheet, p. 9 — Table 2-1. GD32E230xx devices features and peripheral list
io count 39 GigaDevice datasheet, p. 18 — Table 2-4. GD32E230Cx LQFP48 pin definitions
adc resolution 12 bit GigaDevice datasheet, p. 8
core size 32 bit GigaDevice datasheet, p. 8
rise time 50 ns —; tr(lxtal); Low speed external user clock characteristics (LXTAL in bypass mode) GigaDevice datasheet, p. 52 — Table 4-17. Low speed external user clock characteristics (LXTAL…
data retention 10 year 10k cycles at TA = 85°C; tret; Flash memory characteristics GigaDevice datasheet, p. 54 — Table 4-22. Flash memory characteristics
program erase cycles 100 kcycle TA = -40°C ~ +85°C; pecyc(endurance); Flash memory characteristics GigaDevice datasheet, p. 54 — Table 4-22. Flash memory characteristics
output voltage high 2.8 V VDD = 3.3V; voh; GD32E230xx Datasheet GigaDevice datasheet, p. 56 — GD32E230xx Datasheet
output voltage low 200 mV VDD = 1.8V; vol; I/O port DC characteristics GigaDevice datasheet, p. 55 — Table 4-24. I/O port DC characteristics
sample rate 7 kHz 2 MHz 12-bit; fs; ADC characteristics GigaDevice datasheet, p. 58 — Table 4-19. ADC characteristics
02 — Alternatives

Closest matches to GD32E230

GD32E230C4T6 4.0× lower program memory size, 2.0× lower ram size, similar adc resolution
GD32E230K4T6 4.0× lower program memory size, 2.0× lower ram size, similar adc resolution
TMS320F28030 8.3× lower rise time, 2.5× lower input capacitance, 2.0× lower program erase cycles
GD32F303CCT6 11.7× lower clock frequency, 6.0× higher ram size, 4.2× lower rise time
ST7590 11.7× lower clock frequency, 4.2× lower rise time, 3.9× higher ram size
GD32F103RFT6 12.0× higher ram size, 5.8× lower clock frequency, 4.2× lower rise time
STM32F030C8 2.5× higher rise time, 2.4× lower fall time, 2.0× higher data retention
MSPM0G3505SDGS28 14.3× lower rise time, 6.0× higher data retention, 3.6× lower clock frequency
03 — FAQ

Frequently asked questions

What is the ADC resolution of the GD32E230C8T6?

The ADC resolution is 12 bit.

What is the fapb1 clock frequency?

The fapb1 clock frequency is 72 MHz.

What is the core size of the GD32E230C8T6?

The core size is 32 bit.

What is the CPU speed of the GD32E230C8T6?

The CPU speed is 72 MHz.

What is the data retention period for the GD32E230C8T6 Flash memory under the condition of 10k cycles at TA = 85°C?

The data retention is 10 year.

What is the input capacitance (cin) for the Low speed external user clock characteristics (LXTAL in bypass mode)?

The input capacitance is 5 pF.

How many I/O pins does the GD32E230C8T6 have?

The GD32E230C8T6 has 39 I/O pins.

What is the absolute maximum operating temperature (ta) for the GD32E230C8T6?

The absolute maximum operating temperature (ta) is 85 °C.

What is the output voltage high (VOH) for the GD32E230C8T6 when VDD is 3.3V?

The output voltage high is 2.8 V.

What is the output voltage low (vol) for the I/O port DC characteristics when VDD is 1.8V?

The output voltage low is 200 mV.

What is the program erase cycle endurance for the GD32E230C8T6 Flash memory at TA = -40°C ~ +85°C?

The program erase cycle endurance is 100 kcycle.

What is the program memory size of the GD32E230C8T6?

The program memory size is 62.5 KB in flash.

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