STM32F030
Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.
What the STM32F030 family does
The STM32F030x4/x6/x8/xC are 32-bit microcontrollers featuring an Arm Cortex-M0 core running up to 48 MHz. These devices offer 16 to 256 Kbytes of Flash memory, 4 to 32 Kbytes of SRAM, and operate on a 2.4-3.6 V supply. Key specifications include a 12-bit ADC with 16 channels, up to two I2C interfaces, six USARTs, and 55 fast I/Os. The family supports low-power modes like Sleep and Standby, making them suitable for battery-powered applications requiring precise timing and multiple communication protocols.
STM32F030C8 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 5 µA | 32 µA | Regulator in low-power mode, all oscillators OFF; idd; Typical and maximum consumption in Stop and Standby modes | ST datasheet, p. 49 — Table 27. Typical and maximum consumption in Stop and Standby modes |
| supply voltage range | 2.4 V | — | 3.6 V | vdd; General operating conditions | ST datasheet, p. 44 — Table 21. General operating conditions |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| clock frequency | — | 24 MHz | — | fTIMxCLK = 48 MHz; fext; TIMx characteristics | ST datasheet, p. 71 — Table 54. TIMx characteristics |
| power dissipation | — | — | 455 mW | LQFP64; pd; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| cpu speed | — | 48 MHz | — | ST datasheet, p. 1 | |
| program memory size | — | 62.5 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| ram size | — | 7.81 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| io count | — | 39 | — | ST datasheet, p. 28 — Table 11. STM32F030x4/6/8/C pin definitions | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| core size | — | 32 bit | — | ST datasheet, p. 1 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics | ST datasheet, p. 52 — Table 31. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDDIOx≥ 2.4 V; tf(i/o); I/O AC characteristics $ ^{(1)(2)} $ | ST datasheet, p. 65 — Table 48. I/O AC characteristics |
| data retention | 20 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| program erase cycles | 1 kcycle | — | — | TA = -40 to +85 °C; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
STM32F030C8 frequently asked questions
What is the ADC resolution of the STM32F030C8?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32F030C8 when fTIMxCLK = 48 MHz and fext; TIMx characteristics?
The clock frequency is 24 MHz.
What is the core size of the STM32F030C8?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F030C8?
The maximum CPU speed is 48 MHz.
What is the data retention period for the STM32F030C8 Flash memory?
The data retention is 20 year at 1 kcycle(2)at TA = 85 °C; tret.
What is the fall time (tf(i/o)) for the STM32F030C8 under the specified I/O AC characteristics?
The fall time is 125 ns when CL = 50 pF and VDDIOx≥ 2.4 V.
What is the total number of I/O ports available on the STM32F030C8?
The STM32F030C8 has 39 io count.
What is the maximum operating temperature under general operating conditions?
The maximum operating temperature is 85 °C.
What is the power dissipation for the STM32F030C8 in an LQFP64 package under general operating conditions?
The power dissipation is 455 mW.
What is the program erase cycle endurance for the STM32F030C8 Flash memory at TA = -40 to +85 °C?
The program erase cycle endurance is 1 kcycle.
What is the program memory size of the STM32F030C8?
The program memory size is 62.5 KB.
What is the quiescent current (idd) when the regulator is in low-power mode and all oscillators are OFF?
The quiescent current is 5 µA.
STM32F030C8BC81A5D954499D80 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 500 nA | 900 nA | low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz) | ST datasheet, p. 55 — Table 34. LSE oscillator characteristics ( kHz) |
| output current (abs max) | — | — | -25 mA | i(pin); Current characteristics | ST datasheet, p. 44 — Table 19. Current characteristics |
| supply voltage range | 2.4 V | — | 3.6 V | vdd; General operating conditions | ST datasheet, p. 44 — Table 21. General operating conditions |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| clock frequency | — | 24 MHz | — | fTIMxCLK = 48 MHz; fext; TIMx characteristics | ST datasheet, p. 71 — Table 54. TIMx characteristics |
| power dissipation | — | — | 455 mW | LQFP64; pd; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| cpu speed | — | 48 MHz | — | ST datasheet, p. 1 | |
| program memory size | — | 62.5 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| ram size | — | 7.81 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| io count | — | 39 | — | ST datasheet, p. 28 — Table 11. STM32F030x4/6/8/C pin definitions | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| core size | — | 32 bit | — | ST datasheet, p. 1 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics | ST datasheet, p. 52 — Table 31. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDDIOx≥ 2.4 V; tf(i/o); I/O AC characteristics $ ^{(1)(2)} $ | ST datasheet, p. 65 — Table 48. I/O AC characteristics |
| data retention | 20 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| program erase cycles | 1 kcycle | — | — | TA = -40 to +85 °C; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| sample rate | 50 kHz | — | 1 MHz | fs; ADC characteristics | ST datasheet, p. 67 — Table 50. ADC characteristics |
STM32F030C8T6 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| supply voltage range | 2.4 V | — | 3.6 V | vdd; General operating conditions | ST datasheet, p. 44 — Table 21. General operating conditions |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| clock frequency | 0 Hz | — | 48 MHz | fhclk; General operating conditions | ST datasheet, p. 44 — Table 21. General operating conditions |
| power dissipation | — | — | 455 mW | LQFP64; pd; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| cpu speed | — | 48 MHz | — | ST datasheet, p. 1 | |
| program memory size | — | 62.5 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| ram size | — | 7.81 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| io count | — | 39 | — | ST datasheet, p. 28 — Table 11. STM32F030x4/6/8/C pin definitions | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| core size | — | 32 bit | — | ST datasheet, p. 1 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics | ST datasheet, p. 52 — Table 31. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDDIOx≥ 2.4 V; tf(i/o); I/O AC characteristics $ ^{(1)(2)} $ | ST datasheet, p. 65 — Table 48. I/O AC characteristics |
| data retention | 20 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| program erase cycles | 1 kcycle | — | — | TA = -40 to +85 °C; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| sample rate | 50 kHz | — | 1 MHz | fs; ADC characteristics | ST datasheet, p. 67 — Table 50. ADC characteristics |
STM32F030C8T6 frequently asked questions
What is the ADC resolution of the STM32F030C8T6?
The ADC resolution is 12 bit.
What is the maximum clock frequency (fhclk) under general operating conditions?
The maximum clock frequency (fhclk) under general operating conditions is 48 MHz.
What is the core size of the STM32F030C8T6?
The core size is 32 bit.
What is the maximum CPU speed of the STM32F030C8T6?
The maximum CPU speed is 48 MHz.
What is the data retention period for the STM32F030C8T6 Flash memory after 1 kcycle at TA = 85 °C?
The data retention is 20 year.
What is the fall time (tf(i/o)) for the STM32F030C8T6 under the specified I/O AC characteristics?
The fall time is 125 ns when CL = 50 pF and VDDIOx≥ 2.4 V.
What is the number of I/O ports?
The number of I/O ports is 39.
What is the maximum operating temperature under general operating conditions?
The maximum operating temperature is 85 °C.
What is the power dissipation for the STM32F030C8T6 in an LQFP64 package under general operating conditions?
The power dissipation is 455 mW.
What is the program erase cycle endurance for the STM32F030C8T6 Flash memory at TA = -40 to +85 °C?
The program erase cycle endurance is 1 kcycle.
What is the program memory size of the STM32F030C8T6?
The program memory size is 62.5 KB.
What is the RAM size of the STM32F030C8T6?
The RAM size is 7.81 KB.
STM32F030R8 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | — | 500 nA | 900 nA | low drive capability; idd; LSE oscillator characteristics ( $ fLSE = 32.768 $ kHz) | ST datasheet, p. 55 — Table 34. LSE oscillator characteristics ( kHz) |
| output current (abs max) | — | — | -25 mA | i(pin); Current characteristics | ST datasheet, p. 44 — Table 19. Current characteristics |
| supply voltage range | 2.4 V | — | 3.6 V | vdd; General operating conditions | ST datasheet, p. 44 — Table 21. General operating conditions |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation; ta; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| clock frequency | — | 24 MHz | — | fTIMxCLK = 48 MHz; fext; TIMx characteristics | ST datasheet, p. 71 — Table 54. TIMx characteristics |
| power dissipation | — | — | 455 mW | LQFP64; pd; General operating conditions | ST datasheet, p. 45 — Table 21. General operating conditions (continued) |
| cpu speed | — | 48 MHz | — | ST datasheet, p. 1 | |
| program memory size | — | 62.5 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| ram size | — | 7.81 KB | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| io count | — | 55 | — | ST datasheet, p. 28 — Table 11. STM32F030x4/6/8/C pin definitions | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 10 — Table 2. STM32F030x4/x6/x8/xC family device features and peripheral counts | |
| core size | — | 32 bit | — | ST datasheet, p. 1 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics | ST datasheet, p. 52 — Table 31. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDDIOx≥ 2.4 V; tf(i/o); I/O AC characteristics $ ^{(1)(2)} $ | ST datasheet, p. 65 — Table 48. I/O AC characteristics |
| data retention | 20 year | — | — | 1 kcycle(2)at TA = 85 °C; tret; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| program erase cycles | 1 kcycle | — | — | TA = -40 to +85 °C; Flash memory endurance and data retention | ST datasheet, p. 58 — Table 40. Flash memory endurance and data retention |
| sample rate | 50 kHz | — | 1 MHz | fs; ADC characteristics | ST datasheet, p. 67 — Table 50. ADC characteristics |