STM32L011
Every spec below is cited to the manufacturer datasheet. Pick your exact ordering code, compare the closest alternatives, then ask the assistant what it means for your design.
What the STM32L011 family does
The STM32L011x3/x4 are ultra-low-power 32-bit microcontrollers based on the Arm Cortex-M0+ core. This family spans part numbers from the D3 to the K4, offering up to 16KB Flash, 2KB SRAM, and 512B EEPROM. Key specifications include a 1.65 V to 3.6 V power supply, 0.23µA standby current, and a 12-bit ADC running at 1.14Msps. The device supports 41µA for a 12-bit ADC conversion at 10ksps and features a 5µs wakeup time. Engineers typically use these for battery-powered applications requiring long life, such as wearables or remote sensors, leveraging the 7x timers, 5-channel DMA, and multiple communication interfaces like I2C, SPI, and USART.
STM32L011D3 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | 2.2 mA | 2.2 mA | 2.6 mA | Range 2, VCORE = 1.5 V, VOS[1:0] = 10,; 16 MHz; idd(runfromflash); Current consumption in Run mode, code with data processing running from Flash | ST datasheet, p. 53 — Table 22. Current consumption in Run mode, code with data processing runn… |
| output current | — | — | 1 µA | ivref_out; Embedded internal reference voltage $ ^{(1)} $ | ST datasheet, p. 51 — Table 21. Embedded internal reference voltage |
| supply voltage range | 1.65 V | — | 3.6 V | vdd; Flash memory and data EEPROM characteristics | ST datasheet, p. 71 — Table 43. Flash memory and data EEPROM characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation (range 6); ta; General operating conditions | ST datasheet, p. 49 — Table 18. General operating conditions (continued) |
| clock frequency | 140 kHz | — | 16 MHz | Voltage scaling Range 1; fadc; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
| power dissipation | — | — | 83 mW | LQFP32 package; pd(range 3); General operating conditions | ST datasheet, p. 48 — Table 18. General operating conditions |
| input capacitance | — | 600 fF | — | cin(lse); Low-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 65 — Table 36. Low-speed external user clock characteristics |
| propagation delay | — | 3 µs | 10 µs | td; Comparator 1 characteristics | ST datasheet, p. 85 — Table 59. Comparator 1 characteristics |
| cpu speed | — | 32 MHz | — | ST datasheet, p. 10 | |
| program memory size | — | 7.81 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| ram size | — | 1.95 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| io count | — | 11 | — | ST datasheet, p. 37 — Table 13. Pin definitions | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 26 | |
| core size | — | 32 bit | — | ST datasheet, p. 10 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 64 — Table 35. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDD = 2.7 V to 3.6 V; (i/o) | ST datasheet, p. 78 — Table 52. I/O AC characteristics |
| data retention | 10 year | — | — | TRET = +105 °C; tret(eeprom data memory); Flash memory and data EEPROM endurance and retention | ST datasheet, p. 71 — Table 44. Flash memory and data EEPROM endurance and retention |
| sample rate | 50 kHz | — | 1.14 MHz | fs; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
STM32L011D3 frequently asked questions
What is the ADC resolution of the STM32L011D3?
The ADC resolution is 12 bit.
What is the maximum clock frequency for the ADC when operating in Voltage scaling Range 1?
The maximum clock frequency is 16 MHz.
What is the core size of the STM32L011D3?
The core size is 32 bit.
What is the maximum CPU speed of the STM32L011D3?
The maximum CPU speed is 32 MHz.
What is the data retention period for the STM32L011D3 Flash memory and data EEPROM at TRET = +105 °C?
The data retention is 10 year.
What is the fall time for the STM32L011D3 I/O pins?
The fall time is 125 ns when CL = 50 pF and VDD = 2.7 V to 3.6 V.
What is the input capacitance for the Low-speed external user clock?
The input capacitance is 600 fF.
What is the number of I/O ports?
The part has 11 I/O ports.
What is the maximum operating temperature under general operating conditions with maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current for the embedded internal reference voltage (ivref_out)?
The output current is 1 µA.
What is the power dissipation for the STM32L011D3 in an LQFP32 package under general operating conditions?
The power dissipation is 83 mW.
What is the program memory size of the STM32L011D3?
The program memory size is 7.81 KB.
STM32L011E3 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | 2.2 mA | 2.2 mA | 2.6 mA | Range 2, VCORE = 1.5 V, VOS[1:0] = 10,; 16 MHz; idd(runfromflash); Current consumption in Run mode, code with data processing running from Flash | ST datasheet, p. 53 — Table 22. Current consumption in Run mode, code with data processing runn… |
| output current | — | — | 1 µA | ivref_out; Embedded internal reference voltage $ ^{(1)} $ | ST datasheet, p. 51 — Table 21. Embedded internal reference voltage |
| supply voltage range | 1.65 V | — | 3.6 V | vdd; Flash memory and data EEPROM characteristics | ST datasheet, p. 71 — Table 43. Flash memory and data EEPROM characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation (range 6); ta; General operating conditions | ST datasheet, p. 49 — Table 18. General operating conditions (continued) |
| clock frequency | 140 kHz | — | 16 MHz | Voltage scaling Range 1; fadc; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
| power dissipation | — | — | 83 mW | LQFP32 package; pd(range 3); General operating conditions | ST datasheet, p. 48 — Table 18. General operating conditions |
| input capacitance | — | 600 fF | — | cin(lse); Low-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 65 — Table 36. Low-speed external user clock characteristics |
| propagation delay | — | 3 µs | 10 µs | td; Comparator 1 characteristics | ST datasheet, p. 85 — Table 59. Comparator 1 characteristics |
| cpu speed | — | 32 MHz | — | ST datasheet, p. 10 | |
| program memory size | — | 7.81 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| ram size | — | 1.95 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| io count | — | 16 | — | ST datasheet, p. 38 — Table 13. Pin definitions (continued) | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 26 | |
| core size | — | 32 bit | — | ST datasheet, p. 10 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 64 — Table 35. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDD = 2.7 V to 3.6 V; (i/o) | ST datasheet, p. 78 — Table 52. I/O AC characteristics |
| data retention | 10 year | — | — | TRET = +105 °C; tret(eeprom data memory); Flash memory and data EEPROM endurance and retention | ST datasheet, p. 71 — Table 44. Flash memory and data EEPROM endurance and retention |
| sample rate | 50 kHz | — | 1.14 MHz | fs; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
STM32L011E3 frequently asked questions
What is the ADC resolution of the STM32L011E3?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32L011E3 under Voltage scaling Range 1 for ADC characteristics?
The clock frequency is 16 MHz.
What is the core size of the STM32L011E3?
The core size is 32 bit.
What is the maximum CPU speed of the STM32L011E3?
The maximum CPU speed is 32 MHz.
What is the data retention period for the STM32L011E3 Flash memory and data EEPROM at TRET = +105 °C?
The data retention is 10 year.
What is the fall time for the STM32L011E3 when CL = 50 pF and VDD = 2.7 V to 3.6 V (i/o)?
The fall time is 125 ns.
What is the input capacitance (cin(lse)) for the Low-speed external user clock characteristics?
The input capacitance (cin(lse)) is 600 fF.
What is the number of I/O ports?
The number of I/O ports is 16.
What is the maximum operating temperature under general operating conditions with maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current of the embedded internal reference voltage (IVREF_OUT)?
The output current is 1 µA.
What is the power dissipation for the STM32L011E3 in an LQFP32 package under general operating conditions?
The power dissipation is 83 mW.
What is the program memory size of the STM32L011E3?
The program memory size is 7.81 KB.
STM32L011F3 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | 2.2 mA | 2.2 mA | 2.6 mA | Range 2, VCORE = 1.5 V, VOS[1:0] = 10,; 16 MHz; idd(runfromflash); Current consumption in Run mode, code with data processing running from Flash | ST datasheet, p. 53 — Table 22. Current consumption in Run mode, code with data processing runn… |
| output current | — | — | 1 µA | ivref_out; Embedded internal reference voltage $ ^{(1)} $ | ST datasheet, p. 51 — Table 21. Embedded internal reference voltage |
| supply voltage range | 1.65 V | — | 3.6 V | vdd; Flash memory and data EEPROM characteristics | ST datasheet, p. 71 — Table 43. Flash memory and data EEPROM characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation (range 6); ta; General operating conditions | ST datasheet, p. 49 — Table 18. General operating conditions (continued) |
| clock frequency | 140 kHz | — | 16 MHz | Voltage scaling Range 1; fadc; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
| power dissipation | — | — | 83 mW | LQFP32 package; pd(range 3); General operating conditions | ST datasheet, p. 48 — Table 18. General operating conditions |
| input capacitance | — | 600 fF | — | cin(lse); Low-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 65 — Table 36. Low-speed external user clock characteristics |
| propagation delay | — | 3 µs | 10 µs | td; Comparator 1 characteristics | ST datasheet, p. 85 — Table 59. Comparator 1 characteristics |
| cpu speed | — | 32 MHz | — | ST datasheet, p. 10 | |
| program memory size | — | 7.81 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| ram size | — | 1.95 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| io count | — | 16 | — | ST datasheet, p. 38 — Table 13. Pin definitions (continued) | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 26 | |
| core size | — | 32 bit | — | ST datasheet, p. 10 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 64 — Table 35. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDD = 2.7 V to 3.6 V; (i/o) | ST datasheet, p. 78 — Table 52. I/O AC characteristics |
| data retention | 10 year | — | — | TRET = +105 °C; tret(eeprom data memory); Flash memory and data EEPROM endurance and retention | ST datasheet, p. 71 — Table 44. Flash memory and data EEPROM endurance and retention |
| sample rate | 50 kHz | — | 1.14 MHz | fs; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
STM32L011F3 frequently asked questions
What is the ADC resolution of the STM32L011F3?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32L011F3 under Voltage scaling Range 1 for ADC characteristics?
The clock frequency is 16 MHz.
What is the core size of the STM32L011F3?
The core size is 32 bit.
What is the maximum CPU speed of the STM32L011F3?
The maximum CPU speed is 32 MHz.
What is the data retention period for the STM32L011F3 Flash memory and data EEPROM at TRET = +105 °C?
The data retention is 10 year.
What is the fall time for the STM32L011F3 I/O pins?
The fall time is 125 ns when CL = 50 pF and VDD = 2.7 V to 3.6 V.
What is the input capacitance for the Low-speed external user clock (cin(lse))?
The input capacitance is 600 fF.
How many I/O pins does the STM32L011F3 have?
The STM32L011F3 has 16 I/O pins.
What is the maximum operating temperature under general operating conditions with maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current of the embedded internal reference voltage (ivref_out)?
The output current is 1 µA.
What is the power dissipation for the STM32L011F3 in an LQFP32 package under general operating conditions?
The power dissipation is 83 mW.
What is the program memory size of the STM32L011F3?
The program memory size is 7.81 KB.
STM32L011G3 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | 2.2 mA | 2.2 mA | 2.6 mA | Range 2, VCORE = 1.5 V, VOS[1:0] = 10,; 16 MHz; idd(runfromflash); Current consumption in Run mode, code with data processing running from Flash | ST datasheet, p. 53 — Table 22. Current consumption in Run mode, code with data processing runn… |
| output current | — | — | 1 µA | ivref_out; Embedded internal reference voltage $ ^{(1)} $ | ST datasheet, p. 51 — Table 21. Embedded internal reference voltage |
| supply voltage range | 1.65 V | — | 3.6 V | vdd; Flash memory and data EEPROM characteristics | ST datasheet, p. 71 — Table 43. Flash memory and data EEPROM characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation (range 6); ta; General operating conditions | ST datasheet, p. 49 — Table 18. General operating conditions (continued) |
| clock frequency | 140 kHz | — | 16 MHz | Voltage scaling Range 1; fadc; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
| power dissipation | — | — | 83 mW | LQFP32 package; pd(range 3); General operating conditions | ST datasheet, p. 48 — Table 18. General operating conditions |
| input capacitance | — | 600 fF | — | cin(lse); Low-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 65 — Table 36. Low-speed external user clock characteristics |
| propagation delay | — | 3 µs | 10 µs | td; Comparator 1 characteristics | ST datasheet, p. 85 — Table 59. Comparator 1 characteristics |
| cpu speed | — | 32 MHz | — | ST datasheet, p. 10 | |
| program memory size | — | 7.81 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| ram size | — | 1.95 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| io count | — | 24 | — | ST datasheet, p. 40 — Table 13. Pin definitions (continued) | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 26 | |
| core size | — | 32 bit | — | ST datasheet, p. 10 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 64 — Table 35. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDD = 2.7 V to 3.6 V; (i/o) | ST datasheet, p. 78 — Table 52. I/O AC characteristics |
| data retention | 10 year | — | — | TRET = +105 °C; tret(eeprom data memory); Flash memory and data EEPROM endurance and retention | ST datasheet, p. 71 — Table 44. Flash memory and data EEPROM endurance and retention |
| sample rate | 50 kHz | — | 1.14 MHz | fs; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
STM32L011G3 frequently asked questions
What is the ADC resolution of the STM32L011G3?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32L011G3 under Voltage scaling Range 1 for fadc ADC characteristics?
The clock frequency is 16 MHz.
What is the core size of the STM32L011G3?
The core size is 32 bit.
What is the maximum CPU speed of the STM32L011G3?
The maximum CPU speed is 32 MHz.
What is the data retention period for the Flash memory and data EEPROM at TRET = +105 °C?
The data retention is 10 year.
What is the fall time for the STM32L011G3 I/O pins?
The fall time is 125 ns when CL = 50 pF and VDD = 2.7 V to 3.6 V.
What is the input capacitance for the Low-speed external user clock (cin(lse))?
The input capacitance is 600 fF.
What is the I/O count for the STM32L011G3?
The I/O count is 24.
What is the maximum operating temperature under general operating conditions with maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current for the embedded internal reference voltage (ivref_out)?
The output current is 1 µA.
What is the power dissipation for the STM32L011G3 in an LQFP32 package under general operating conditions?
The power dissipation is 83 mW.
What is the program memory size of the STM32L011G3?
The program memory size is 7.81 KB.
STM32L011K3 datasheet parameters
| Parameter | Min | Typ | Max | Conditions | Source |
|---|---|---|---|---|---|
| quiescent current | 2.2 mA | 2.2 mA | 2.6 mA | Range 2, VCORE = 1.5 V, VOS[1:0] = 10,; 16 MHz; idd(runfromflash); Current consumption in Run mode, code with data processing running from Flash | ST datasheet, p. 53 — Table 22. Current consumption in Run mode, code with data processing runn… |
| output current | — | — | 1 µA | ivref_out; Embedded internal reference voltage $ ^{(1)} $ | ST datasheet, p. 51 — Table 21. Embedded internal reference voltage |
| supply voltage range | 1.65 V | — | 3.6 V | vdd; Flash memory and data EEPROM characteristics | ST datasheet, p. 71 — Table 43. Flash memory and data EEPROM characteristics |
| operating temperature | -40 °C | — | 85 °C | Maximum power dissipation (range 6); ta; General operating conditions | ST datasheet, p. 49 — Table 18. General operating conditions (continued) |
| clock frequency | 140 kHz | — | 16 MHz | Voltage scaling Range 1; fadc; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
| power dissipation | — | — | 83 mW | LQFP32 package; pd(range 3); General operating conditions | ST datasheet, p. 48 — Table 18. General operating conditions |
| input capacitance | — | 600 fF | — | cin(lse); Low-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 65 — Table 36. Low-speed external user clock characteristics |
| propagation delay | — | 3 µs | 10 µs | td; Comparator 1 characteristics | ST datasheet, p. 85 — Table 59. Comparator 1 characteristics |
| cpu speed | — | 32 MHz | — | ST datasheet, p. 10 | |
| program memory size | — | 7.81 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| ram size | — | 1.95 KB | — | ST datasheet, p. 11 — Table 2. Ultra-low-power STM32L011x3/x4 device features and peripheral co… | |
| io count | — | 26 | — | ST datasheet, p. 11 | |
| adc resolution | — | 12 bit | — | ST datasheet, p. 26 | |
| core size | — | 32 bit | — | ST datasheet, p. 10 | |
| rise time | — | — | 20 ns | tr(hse); High-speed external user clock characteristics $ ^{(1)} $ | ST datasheet, p. 64 — Table 35. High-speed external user clock characteristics |
| fall time | — | — | 125 ns | CL = 50 pF, VDD = 2.7 V to 3.6 V; (i/o) | ST datasheet, p. 78 — Table 52. I/O AC characteristics |
| data retention | 10 year | — | — | TRET = +105 °C; tret(eeprom data memory); Flash memory and data EEPROM endurance and retention | ST datasheet, p. 71 — Table 44. Flash memory and data EEPROM endurance and retention |
| sample rate | 50 kHz | — | 1.14 MHz | fs; ADC characteristics | ST datasheet, p. 80 — Table 54. ADC characteristics |
STM32L011K3 frequently asked questions
What is the ADC resolution of the STM32L011K3?
The ADC resolution is 12 bit.
What is the clock frequency for the STM32L011K3 under Voltage scaling Range 1 for fadc ADC characteristics?
The clock frequency is 16 MHz.
What is the core size of the STM32L011K3?
The core size is 32 bit.
What is the maximum CPU speed of the STM32L011K3?
The maximum CPU speed is 32 MHz.
What is the data retention period for the Flash memory and data EEPROM at TRET = +105 °C?
The data retention is 10 year.
What is the fall time for the STM32L011K3 I/O pins?
The fall time is 125 ns when CL = 50 pF and VDD = 2.7 V to 3.6 V.
What is the input capacitance for the Low-speed external user clock (cin(lse))?
The input capacitance is 600 fF.
What is the number of I/O ports?
The number of I/O ports is 26.
What is the maximum operating temperature under general operating conditions with maximum power dissipation?
The maximum operating temperature is 85 °C.
What is the output current for the embedded internal reference voltage (IVREF_OUT)?
The output current is 1 µA.
What is the power dissipation for the STM32L011K3 in an LQFP32 package under general operating conditions?
The power dissipation is 83 mW.
What is the program memory size of the STM32L011K3?
The program memory size is 7.81 KB.